Requirements of the methods for metal separation in printed circuit board technology, and their capacity for being fulfilled
Abstract
The current production methods for printed circuit boards were examined based on etching technology with metallized holes. The main metal coatings in the printed circuit board technology, and their function and production purpose were surveyed. Two samples were coated using large-scale uncoated surfaces and a continuous copper plating of the entire surface.
- Publication:
-
NASA STI/Recon Technical Report N
- Pub Date:
- July 1978
- Bibcode:
- 1978STIN...7918171K
- Keywords:
-
- Circuit Boards;
- Metallizing;
- Printed Circuits;
- Technology Assessment;
- Copper;
- Current Density;
- Electric Current;
- Electroplating;
- Etching;
- Hole Distribution (Electronics);
- Metal Coatings;
- Plating;
- Production Engineering;
- Separation;
- Surface Finishing;
- Electronics and Electrical Engineering