Evaluation of ceramic DIP carrier
Abstract
A system of mounting dual in-line packages on ceramic substrates without the use of conventional through-holes is found to be feasible. Thermal information relating to substrate performance is developed. A protective coating for copper is discovered.
- Publication:
-
NASA STI/Recon Technical Report N
- Pub Date:
- June 1978
- Bibcode:
- 1978STIN...7910351M
- Keywords:
-
- Ceramic Coatings;
- Microelectronics;
- Packages;
- Wireless Communication;
- Electronic Equipment;
- Feasibility Analysis;
- Heat Transfer;
- Substrates;
- Electronics and Electrical Engineering