HMC-to-flatpack attachment
Abstract
A method was developed for attaching a completed hybrid microcircuit to a flatpack which can then be hermetically sealed. Ablefilm 517B and Epo-Tek H77 epoxies, in conjunction with an abraded flatpack and applied pressure during cure, were shown to provide HMC-to-flatpack bonds which meet all environmental and processing requirements of hybrid microcircuits.
- Publication:
-
NASA STI/Recon Technical Report N
- Pub Date:
- April 1978
- Bibcode:
- 1978STIN...7830533Z
- Keywords:
-
- Bonding;
- Hermetic Seals;
- Hybrid Circuits;
- Semiconductor Devices;
- Aluminum Oxides;
- Chemical Cleaning;
- Environmental Tests;
- Microelectronics;
- Electronics and Electrical Engineering