Thermal management of the Standard Electronic Module /SEM/
Abstract
The concept of the Standard Electronic Module (SEM) presents a challenging thermal problem, since the design goal is to provide a cooling technique that is sufficiently versatile for a variety of electronic components. To satisfy the thermal requirements for SEM an extensive analysis was conducted to compare possible thermal design concepts. The concepts considered utilized a combination of conduction and convection heat transfer to a designated air supply. The techniques investigated include conduction to heat exchangers in the ATR case side walls by means of metal or heat pipe overlays on the printed wiring boards (PWB's), heat exchangers bonded between PWB pairs, and hollow tube heat exchangers in direct contact with the PWB electronic components. The results of the analysis illustrate the thermal characteristics and the power dissipating capabilities of the designs most compatible with the SEM concept.
- Publication:
-
NAECON 1977; Proceedings of the National Aerospace and Electronics Conference
- Pub Date:
- 1977
- Bibcode:
- 1977naec.conf...86K
- Keywords:
-
- Avionics;
- Cooling Systems;
- Electronic Modules;
- Military Technology;
- Temperature Control;
- Air Flow;
- Convective Heat Transfer;
- Design Analysis;
- Heat Exchangers;
- Pressure Drop;
- Electronics and Electrical Engineering