Evaluation of microcircuits using scanning electron microscopy
Abstract
The SEM test method (Method 2018 of MIL-STD-883) is considered a suitable means of ensuring the quality of metal interconnections on semiconductors. It can be applied equally well to simple configurations and complex configurations (multilayered metal systems, interdigitated or mesh structures devices, glassivated circuits, LSI circuits, etc.). In the test procedure, two specific regions of examination are of interest: (1) the region where metallization extends over an oxide step, and (2) the general metallization, i.e., the conductor pattern at all locations except at oxide steps.
- Publication:
-
In: Aerospace Testing Seminar
- Pub Date:
- 1977
- Bibcode:
- 1977aets.proc...95F
- Keywords:
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- Electric Contacts;
- Electron Microscopy;
- Electronic Equipment Tests;
- Metal Films;
- Microelectronics;
- Large Scale Integration;
- Oxide Films;
- Semiconductor Devices;
- Electronics and Electrical Engineering