A process was developed for depositing 10 microns thick tungsten films on compression bonded silicon pellets, thereby improving the surge current rating among other characteristics. The process, the performance of the coated diodes, and a coating unit are described.
NASA STI/Recon Technical Report N
- Pub Date:
- August 1977
- Electric Current;
- Metal Films;
- Semiconductor Devices;
- Electronics and Electrical Engineering