A model of the exposure and development processes of a positive photosensitive resin - Application to projective masking
Abstract
The authors present a mathematical model for simulating the mechanisms of exposure and dissolution of a film of positive photoresist. The image recording is considered with due allowance for the two-dimensional aspect of the photosensitive medium and for the presence of the substrate. A profile of the image restored after dissolution is accomplished by simulating the action of the developer at macroscopic level, using a cellular approach. The experimental profiles obtained by projection in microphotoetching are compared with their simulated counterparts. The program possibilities and its applications are examined. The application of the model to direct projection of an image on silicon is the subject of a detailed analysis, and makes possible the determination of the critical parameters of the photolithographic process, by nomograms.
- Publication:
-
Revue Technique Thomson CSF
- Pub Date:
- June 1977
- Bibcode:
- 1977RvT.....9..285B
- Keywords:
-
- Imaging Techniques;
- Integrated Circuits;
- Masking;
- Photoabsorption;
- Photoconductors;
- Photosensitivity;
- Electron Beams;
- Lithography;
- Mathematical Models;
- Photoengraving;
- Resins;
- Silicon;
- Instrumentation and Photography