On the alloying of aluminium to silicon in the fabrication of integrated circuits
Abstract
The alloying of aluminium to silicon during the fabrication of silicon integrated circuits, as is well known, often results in 'spearing' at the contact windows and that this represents a possible failure mechanism. The morphology and kinetics of the spearing process are discussed, in particular, evidence for the existence of a liquid phase at alloying temperatures below the silicon-aluminium eutectic point and the silicon-aluminium dissolution mechanism which always leaves spears with identical orientations. A critical survey is then made of the various metallisation techniques involving aluminium by which it is alleged spearing can be prevented.
- Publication:
-
Microelectronics Reliability
- Pub Date:
- 1977
- Bibcode:
- 1977MiRe...16..165B
- Keywords:
-
- Alloying;
- Aluminum Alloys;
- Failure Analysis;
- Integrated Circuits;
- Microelectronics;
- Silicon Alloys;
- Electronic Equipment Tests;
- Eutectic Alloys;
- Fabrication;
- Metallizing;
- Electronics and Electrical Engineering