A simple approach to cooling hot ICs with heat sinks
Abstract
Procedures for selecting appropriate heat sinks to use with integrated circuits are considered. Equations used for calculating IC thermal resistance and the required heat-sink thermal resistance are explained, and a chart is provided from which the thermal resistance of a heat sink can be estimated in terms of its surface area, thickness, material, and mode of mounting. Also discussed are the properties of different heat-sink shapes, and the appropriate manner for mounting heat sinks to improve heat dissipation.
- Publication:
-
Machine Design
- Pub Date:
- May 1977
- Bibcode:
- 1977MaDes..49..106A
- Keywords:
-
- Circuit Protection;
- Cooling;
- Heat Sinks;
- Integrated Circuits;
- Thermal Resistance;
- Convective Heat Transfer;
- Design Analysis;
- Energy Dissipation;
- Printed Circuits;
- Electronics and Electrical Engineering