Electrical properties of adhesives used in hybrid microelectronic applications
Abstract
This paper describes a test program conducted to determine the electrical properties of adhesives used in hybrid microelectronic applications and to develop test methods for measuring these properties. The electrical properties of transistor chips mounted with conductive adhesives are also measured, and the effect of long term storage at high temperature on these devices is determined.
- Publication:
-
26th Electronic Components Conference
- Pub Date:
- 1976
- Bibcode:
- 1976elco.conf..373S
- Keywords:
-
- Adhesives;
- Electrical Properties;
- Hybrid Circuits;
- Integrated Circuits;
- Long Term Effects;
- Microelectronics;
- Chips;
- Electronic Equipment Tests;
- High Temperature Environments;
- Junction Transistors;
- Organic Materials;
- Electronics and Electrical Engineering