Fundamentals of integrated circuits
Abstract
Technology and reliability of IC are emphasized. The article reviews photolithographic artwork techniques, MOS and SOS technology, assembly and packaging of IC systems, process control for very low failure rate, and failure analysis technology. Designing test device patterns into the system to facilitate failure and reliability monitoring in-process is described, along with the fabrication of rubyliths and various photolithographic techniques. New developments of interest in military IC, specifically continuously variable slope delta (CVSD) IC technology, are mentioned.
- Publication:
-
Electronic
- Pub Date:
- October 1976
- Bibcode:
- 1976eeoic...2...22Z
- Keywords:
-
- Circuit Reliability;
- Electronic Packaging;
- Integrated Circuits;
- Metal Oxide Semiconductors;
- Sos (Semiconductors);
- Technology Assessment;
- Assemblies;
- Component Reliability;
- Fabrication;
- Failure Analysis;
- Lithography;
- Photography;
- Production Engineering;
- Electronics and Electrical Engineering