Plating hybrid microcircuits
Abstract
A nonproprietary and a proprietary gold plating bath were investigated to determine if they were capable of producing thick (76 micrometer) films for RF hybrid microcircuits. Both solutions were found to produce high purity, soft gold deposits over a wide range of plating conditions. Test circuits plated with 6, 10, and 25 micrometer gold deposits passed the HMC production requirements of bondability, through-hole resistance, and other electrical characteristics.
- Publication:
-
Final Report Bendix Corp
- Pub Date:
- September 1976
- Bibcode:
- 1976bend.reptQ....C
- Keywords:
-
- Gold;
- Hybrid Circuits;
- Plating;
- Electrical Properties;
- Microelectronics;
- Radio Frequencies;
- Thick Films;
- Electronics and Electrical Engineering