A new ceramic flat pack for quartz resonators

The performance of quartz resonators is strongly dependent on the method of packaging. The stringent performance requirements imposed by modern communication and navigation systems has necessitated the development of a family of microcircuit compatible quartz crystal units for which a new flat package configuration, a ceramic material, a new sealing technique, and novel mounting methods will be used. This report discusses the criteria used to arrive at the new package design. The package consists of a frame with a top and bottom lid. The frame is constructed by a multilayer ceramic technique, with buried layer metallization for the electrical connections. The ceramic currently being used is Al2O3 and the feedthrough metallization is tungsten. The package has low capacitance.