Large package hybrid qualification tests
Abstract
This report presents the results of a study to determine the capability of large Hybrid packages to withstand the MIL-STD-883, Test Methods and Procedures for Microelectronics, environmental tests recommended for monolithic ICs, and to develop an updated prediction model for large Hybrid packages for inclusion in MIL-HDBK-217B. It was found that the ability to pass various environmental tests varied widely from package to package but generally, suitable stress levels (from MIL-STD-883) were found for each package type. An updated prediction model was developed. In so doing the complexity curves were modified, new examples given and the use of the heat sink temperature versus temperature factor curve clarified. Finally, a simplified prediction model was developed.
- Publication:
-
NASA STI/Recon Technical Report N
- Pub Date:
- March 1976
- Bibcode:
- 1976STIN...7633430S
- Keywords:
-
- Integrated Circuits;
- Microelectronics;
- Quality Control;
- Reliability Engineering;
- Circuit Reliability;
- Environmental Tests;
- Heat Sinks;
- Mathematical Models;
- Prediction Analysis Techniques;
- Temperature Effects;
- Electronics and Electrical Engineering