Advances in integrated circuit reliability

Corrosion of IC metallization is eliminated as a major failure mode by introducing Si3N4 passivated Ti-Pt-Au metallized chips in dual-in-line plastic encapsulated IC packages. The three-step metallization process, the plastic encapsulation system, the passivated trimetal system, and reliability testing are described. Formulation of ohmic contacts, interconnection network and bond pads, and CVD Si3N4 and phosphosilicate glass, and automatic assembly systems are mentioned. Ways of coping with electromigration, corrosion, and formation of electroplated migrative short circuits (as the three major failure mechanisms) are discussed. Accelerated life test results and environmental tests under tropical conditions are mentioned.