Steady heat transfer to laminar flow between parallel plates with conduction in wall
Abstract
For the case where constant heat flux or constant temperature was given at both outer surfaces of parallel plates, a theoretical analysis was made, assuming that temperature distribution at inner surface was represented by a power series. For example, numerical calculations of the theoretical result were carried out for several conditions at Pe = 500. Influences of wall thickness and ratio of thermal conductivity of wall to that of fluid on distributions of interfacial temperature and local Nusselt number were examined concretely. For the case of constant heat flux, the influence was significant for large values of the conductivity ratio. For the case of constant temperature, on the contrary, the influence was significant for small values. Experiments were carried out for the case of constant temperature at the outer surfaces. The experimental results were in good agreement with theoretical values.
 Publication:

Kagaku Kogaku Ronbunshu
 Pub Date:
 December 1976
 Bibcode:
 1976KKR.....1..235M
 Keywords:

 Conductive Heat Transfer;
 Laminar Flow;
 Laminar Heat Transfer;
 Parallel Plates;
 Wall Flow;
 Channel Flow;
 Heat Flux;
 Nusselt Number;
 Temperature Distribution;
 Thermal Conductivity;
 Wall Temperature;
 Fluid Mechanics and Heat Transfer