A new coherent technology for the assembly of thin-film hybrid circuits
Abstract
Various methods for the assembly of hybrid circuits with thin NiCr-Au films are reviewed. Bonding techniques for encapsulated thin-film miniature circuits are described. These methods include hot gas bonding for obtaining an Au-Si eutectic, ultrasonic bonding of Al-Si fibers into the thin film to prevent the formation of intermetallics in the hot zones of the chip, and diffusion bonding of St-Pb-Ag into thin-film ceramic capacitors. Circuit protection aspects are touched upon, and a table presenting results of reliability testing is included.
- Publication:
-
Alta Frequenza
- Pub Date:
- January 1976
- Bibcode:
- 1976AlFr...45...72C
- Keywords:
-
- Hybrid Circuits;
- Metal-Metal Bonding;
- Miniature Electronic Equipment;
- Production Engineering;
- Thin Films;
- Ultrasonic Soldering;
- Aluminum Alloys;
- Capacitors;
- Ceramics;
- Circuit Protection;
- Circuit Reliability;
- Eutectics;
- Gold;
- Intermetallics;
- Silicon Alloys;
- Electronics and Electrical Engineering