Evaluation of pin insertion technique to reduce board damage
Abstract
A summary is given of a number of techniques for installing pins into glass-epoxy boards, taking into account the forced interference fit and the select solder technique. Certain difficulties inherent in former methods of pin installation can be overcome with the aid of an alternate technique, called action pin. The use of the various techniques is illustrated with the aid of several microphotographs.
- Publication:
-
NAECON 1975; Proceedings of the National Aerospace and Electronics Conference
- Pub Date:
- 1975
- Bibcode:
- 1975naec.conf..720C
- Keywords:
-
- Circuit Boards;
- Electric Connectors;
- Electronic Packaging;
- Glass Fiber Reinforced Plastics;
- Insertion;
- Interference Fit;
- Printed Circuits;
- Electronics and Electrical Engineering