Matrix method of designing interconnections for standard printed circuit boards
Abstract
The method proposed is derived from existing solutions to problems involving minimization of interconnections, combining logical cells into modules, and arrangement of modules in printed circuit boards. The method makes it possible to increase the density of module arrangement on bilateral boards, or to decrease the number of layers on multilayer boards, at the same time decreasing the circuit packaging density.
- Publication:
-
Upravliaiushchie Sistemy i Mashiny
- Pub Date:
- October 1975
- Bibcode:
- 1975UpSM.......128G
- Keywords:
-
- Circuit Boards;
- Electronic Packaging;
- Logic Circuits;
- Matrices (Circuits);
- Printed Circuits;
- Electric Contacts;
- Electronic Modules;
- Microelectronics;
- Packing Density;
- Electronics and Electrical Engineering