Failure analysis of electronic parts: Laboratory methods
Abstract
Failure analysis test methods are presented for use in analyzing candidate electronic parts and in improving future design reliability. Each test is classified as nondestructive, semidestructive, or destructive. The effects upon applicable part types (i.e. integrated circuit, transitor) are discussed. Methodology is given for performing the following: immersion tests, radio graphic tests, dewpoint tests, gas ambient analysis, cross sectioning, and ultraviolet examination.
- Publication:
-
NASA STI/Recon Technical Report N
- Pub Date:
- 1975
- Bibcode:
- 1975STIN...7523853A
- Keywords:
-
- Destructive Tests;
- Electronic Equipment Tests;
- Failure Analysis;
- Nondestructive Tests;
- High Temperature Tests;
- Impact Tests;
- Radiography;
- Reliability;
- Tolerances (Mechanics);
- Wear Tests;
- Electronics and Electrical Engineering