Three-dimensional analysis of electrothermal integrated circuits
Abstract
An attempt is made to apply the method of finite elements to the analysis of electro-thermal circuits (ETC). Then a detailed three-dimensional analysis of the ETC is carried out by the method of Green's Function. A general expression for the ETC transfer function is derived, which also contains an impedance boundary condition on the top surface of ETC. A computer program is developed which evaluates the frequency response of an arbitrary configuration of uniform rectangular sensors and heaters. A general expression for the transfer function for a multi-layered ETC is derived. Experimental frequency response measurements agree with the predicted responses. Particularly small and nearly cubical ETC's with dimensions of the order of the thickness of silicon chips have been fabricated and their frequency and response measurements are given. These experimental measurements display the three-dimensional effects predicted by the theoretical results.
- Publication:
-
Ph.D. Thesis
- Pub Date:
- 1975
- Bibcode:
- 1975PhDT........31A
- Keywords:
-
- Finite Element Method;
- Green'S Functions;
- Integrated Circuits;
- Computer Programs;
- Electrical Impedance;
- Frequency Measurement;
- Transfer Functions;
- Electronics and Electrical Engineering