A technique for examining submicron particulate matter on semiconductor device wafers
Abstract
A technique is described for locating and consequently removing submicron particulate matter from semiconductor device wafers. Chemical and structural analyses of these particulates are obtained from energy dispersive X-ray spectra and selected area electron diffraction patterns, respectively.
- Publication:
-
Journal of Testing Evaluation
- Pub Date:
- September 1975
- Bibcode:
- 1975JTeEv...3..389B
- Keywords:
-
- Electron Diffraction;
- Particulate Sampling;
- Quality Control;
- Semiconductor Devices;
- Wafers;
- X Ray Analysis;
- Chemical Analysis;
- Clean Rooms;
- Electron Microscopes;
- Particulates;
- Structural Analysis;
- X Ray Spectra;
- Electronics and Electrical Engineering