Technology and fabrication support for thick film microelectronics and printed wiring boards

Potential applications for hybrid microelectronics in Army Missiles were to be evaluated and sample hardware designed, fabricated and tested. Of particular interest was the design approaches, processing methods and fabrication techniques. The application selected to be the prime demonstration vehicle was the THAD Six Inch Missile Autopilot. The specific objectives with respect to this technology evaluation were to design, fabricate and evaluate hybrid modules to perform the circuit functions of the existing discrete design and to design a multilayer printed wiring board and third level package to the point that the overall impact of the hybrid microelectronics packaging approach could be compared with the discrete design at the Autopilot subassembly level.