Comparative study between wet and dry etching of silicon for microchannels fabrication
Abstract
In this work we present a comparative study of two processes for the fabrication of an array of microchannels for microfluidics applications, based on integrated-circuit technology process steps, such as lithography and dry etching. Two different methods were investigated in order to study the resulting microstructures: wet and dry deep etching of silicon substrate. The typical etching depth necessary to the target application is 50 μm.
- Publication:
-
Advanced Fabrication Technologies for Micro/Nano Optics and Photonics XII
- Pub Date:
- March 2019
- DOI:
- 10.1117/12.2506804
- Bibcode:
- 2019SPIE10930E..15C