Reliability analysis of different structure parameters of PCBA under drop impact
Abstract
The establishing process of PCBA is modelled by finite element analysis software ABAQUS. Firstly, introduce the Input-G method and the fatigue life under drop impact are introduced and the mechanism of the solder joint failure in the process of drop is analysed. The main reason of solder joint failure is that the PCB component is suffering repeated tension and compression stress during the drop impact. Finally, the equivalent stress and peel stress of different solder joint and plate-level components under different impact acceleration are also analysed. The results show that the reliability of tin-silver copper joint is better than that of tin- lead solder joint, and the fatigue life of solder joint expectancy decrease as the impact pulse amplitude increases.
- Publication:
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Journal of Physics Conference Series
- Pub Date:
- March 2018
- DOI:
- 10.1088/1742-6596/986/1/012007
- Bibcode:
- 2018JPhCS.986a2007L