Thermal stability and separation characteristics of anti-sticking layers of Pt/Cr films for the hot slumping technique
Abstract
The thermal stability and separation characteristics of anti-sticking layers of Pt/Cr films are studied in this paper. Several types of adhesion layers were investigated: 10.0 nm Pt, 1.5 nm Cr + 50.0 nm Pt, 2.5 nm Cr + 50.0 nm Pt and 3.5 nm Cr + 50.0 nm Pt fabricated using direct current magnetron sputtering. The variation of layer thickness, roughness, crystallization and surface topography of Pt/Cr films were analyzed by grazing incidence X-ray reflectometry, large angle X-ray diffraction and optical profiler before and after heating. 2.5 nm Cr + 50.0 nm Pt film exhibits the best thermal stability and separation characteristics according to the heating and hot slumping experiments. The film was also applied as an anti-sticking layer to optimize the maximum temperature of the hot slumping technique.
Supported by CAS XTP project XDA04060605- Publication:
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Chinese Physics C
- Pub Date:
- July 2016
- DOI:
- 10.1088/1674-1137/40/7/079001
- arXiv:
- arXiv:1509.08673
- Bibcode:
- 2016ChPhC..40g9001M
- Keywords:
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- Condensed Matter - Materials Science
- E-Print:
- doi:10.1088/1674-1137/40/7/079001