Mobility Improvement After HCl Post-Deposition Cleaning of High- kappa Dielectric: A Potential Issue in Wet Etching of Dual Metal Gate Process Technology
Abstract
- Publication:
-
IEEE Electron Device Letters
- Pub Date:
- March 2005
- DOI:
- 10.1109/LED.2005.843210
- Bibcode:
- 2005IEDL...26..163A