Process and Device Performance of Submicrometer-Channel CMOS Devices Using Deep-Trench Isolation and Self-Aligned TiSi/sub 2/ Technologies
Abstract
- Publication:
-
IEEE Journal of Solid-State Circuits
- Pub Date:
- February 1985
- DOI:
- 10.1109/JSSC.1985.1052282
- Bibcode:
- 1985IJSSC..20..104Y