mm-Wave and sub-THz Chip-to-Package Transitions for Communications Systems
Abstract
This work presents mm-Wave and sub-THz chip-to-package transitions for communications systems. To date, reported transitions either have high loss, typically 3 to 4 dB, or require high cost packages to support very fine bump pitches and low loss materials. We analyze the impact of transitions on a high frequency, wide bandwidth communication system and present the design of a chip-to-package transition in two different commercial packaging technologies. The proposed transitions achieve <1 dB loss in both technologies, validating the design methodology.
- Publication:
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arXiv e-prints
- Pub Date:
- April 2024
- DOI:
- 10.48550/arXiv.2404.19263
- arXiv:
- arXiv:2404.19263
- Bibcode:
- 2024arXiv240419263B
- Keywords:
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- Electrical Engineering and Systems Science - Systems and Control
- E-Print:
- 8 pages, 16 figures, to be submitted to an IEEE Journal. The first two authors are co-first authors