Timing resolution performance of Timepix4 bump-bonded assemblies
Abstract
The timing performance of the Timepix4 application-specific integrated circuit (ASIC) bump-bonded to a $100\;\mu\textrm{m}$ thick n-on-p silicon sensor is presented. A picosecond pulsed infrared laser was used to generate electron-hole pairs in the silicon bulk in a repeatable fashion, controlling the amount, position and time of the stimulated charge signal. The timing resolution for a single pixel has been measured to $107\;\textrm{ps}$ r.m.s. for laser-stimulated signals in the silicon sensor bulk. Considering multi-pixel clusters, the measured timing resolution reached $33\;\textrm{ps}$ r.m.s. exploiting oversampling of the timing information over several pixels.
- Publication:
-
arXiv e-prints
- Pub Date:
- April 2024
- DOI:
- 10.48550/arXiv.2404.15499
- arXiv:
- arXiv:2404.15499
- Bibcode:
- 2024arXiv240415499B
- Keywords:
-
- Physics - Instrumentation and Detectors
- E-Print:
- 22 pages, 29 figures, Prepared for submission to JINST