A high-entropy alloy as very low melting point solder for advanced electronic packaging
Abstract
SnBiInZn-based high-entropy alloy (HEA) was studied as a low reflow temperature solder with melting point around 80 °C. The wetting angle is about 52° after reflow at 100 °C for 10 min. The intermetallic compound (IMC) growth kinetics was measured to be ripening-control with a low activation energy about 18.0 kJ/mol; however, the interfacial reaction rate is very slow, leading to the formation of a very thin IMC layer. The low melting point HEA solder has potential applications in advanced electronic packaging technology, especially for biomedical devices.
- Publication:
-
Materials Today Advances
- Pub Date:
- September 2020
- DOI:
- 10.1016/j.mtadv.2020.100101
- arXiv:
- arXiv:2006.01345
- Bibcode:
- 2020MTAdv...700101L
- Keywords:
-
- Pb-free solder;
- Diffusion kinetics;
- Liquid-solid reactions;
- High-entropy alloy;
- Advanced electronic packaging technology;
- Physics - Applied Physics;
- Condensed Matter - Materials Science
- E-Print:
- 20 pages, 7 figures