3D integrated superconducting qubits
Abstract
As the field of quantum computing advances from the few-qubit stage to larger-scale processors, qubit addressability and extensibility will necessitate the use of 3D integration and packaging. While 3D integration is well-developed for commercial electronics, relatively little work has been performed to determine its compatibility with high-coherence solid-state qubits. Of particular concern, qubit coherence times can be suppressed by the requisite processing steps and close proximity of another chip. In this work, we use a flip-chip process to bond a chip with superconducting flux qubits to another chip containing structures for qubit readout and control. We demonstrate that high qubit coherence (T1, T2,echo > 20 μs) is maintained in a flip-chip geometry in the presence of galvanic, capacitive, and inductive coupling between the chips.
- Publication:
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npj Quantum Information
- Pub Date:
- October 2017
- DOI:
- 10.1038/s41534-017-0044-0
- arXiv:
- arXiv:1706.04116
- Bibcode:
- 2017npjQI...3...42R
- Keywords:
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- Quantum Physics
- E-Print:
- npj Quantum Informationvolume 3, Article number: 42 (2017)