Nanoscale SOI MOSFETs with electrically induced source/drain extension: Novel attributes and design considerations for suppressed short-channel effects
Abstract
Design considerations for a below 100 nm channel length SOI MOSFET with electrically induced shallow source/drain junctions are presented. Our simulation results demonstrate that the application of induced source/drain extensions to the SOI MOSFET will successfully control the SCEs and improve the breakdown voltage even for channel lengths less than 50 nm. We conclude that if the side gate length equals the main gate length, the hot electron effect diminishes optimally.
- Publication:
-
Superlattices and Microstructures
- Pub Date:
- May 2006
- DOI:
- 10.1016/j.spmi.2005.08.020
- arXiv:
- arXiv:1010.3487
- Bibcode:
- 2006SuMi...39..395O
- Keywords:
-
- Condensed Matter - Mesoscale and Nanoscale Physics
- E-Print:
- Superlattices and Microstructures, Vol.39, pp. 395-405, May 2006