It is often observed that thermal stress enhances crack propagation in materials, and conversely, crack propagation can contribute to temperature shifts in materials. In this study, we first consider the thermoelasticity model proposed by M. A. Biot (1956) and study its energy dissipation property. The Biot thermoelasticity model takes into account the following effects. Thermal expansion and contraction are caused by temperature changes, and conversely, temperatures decrease in expanding areas but increase in contracting areas. In addition, we examine its thermomechanical properties through several numerical examples and observe that the stress near a singular point is enhanced by the thermoelastic effect. In the second part, we propose two crack propagation models under thermal stress by coupling a phase field model for crack propagation and the Biot thermoelasticity model and show their variational structures. In our numerical experiments, we investigate how thermal coupling affects the crack speed and shape. In particular, we observe that the lowest temperature appears near the crack tip, and the crack propagation is accelerated by the enhanced thermal stress.