Interface reaction and intermetallic compound growth behavior of Sn-Ag-Cu lead-free solder joints on different substrates in electronic packaging
Abstract
- Publication:
-
Journal of Materials Science
- Pub Date:
- January 2019
- DOI:
- 10.1007/s10853-018-2907-y
- Bibcode:
- 2019JMatS..54.1741X