Quality control and authentication of packaged integrated circuits using enhanced-spatial-resolution terahertz time-domain spectroscopy and imaging
In this paper, a comprehensive set of techniques for quality control and authentication of packaged integrated circuits (IC) using terahertz (THz) time-domain spectroscopy (TDS) is developed. By material characterization, the presence of unexpected materials in counterfeit components is revealed. Blacktopping layers are detected using THz time-of-flight tomography, and thickness of hidden layers is measured. Sanded and contaminated components are detected by THz reflection-mode imaging. Differences between inside structures of counterfeit and authentic components are revealed through developing THz transmission imaging. For enabling accurate measurement of features by THz transmission imaging, a novel resolution enhancement technique (RET) has been developed. This RET is based on deconvolution of the THz image and the THz point spread function (PSF). The THz PSF is mathematically modeled through incorporating the spectrum of the THz imaging system, the axis of propagation of the beam, and the intensity extinction coefficient of the object into a Gaussian beam distribution. As a result of implementing this RET, the accuracy of the measurements on THz images has been improved from 2.4 mm to 0.1 mm and bond wires as small as 550 μm inside the packaging of the ICs are imaged.