Thermal atomic layer deposition of Sn metal using SnCl4 and a vapor phase silyl dihydropyrazine reducing agent
Abstract
- Publication:
-
Journal of Vacuum Science Technology A: Vacuum Surfaces and Films
- Pub Date:
- November 2018
- DOI:
- 10.1116/1.5055212
- Bibcode:
- 2018JVSTA..36fA106S