This paper present a numerical analysis of molded underfill (MUF) for multi flip chip package during encapsulation. Castro Macosko model is used in ANSYS fluent to describe the flow behavior of the EMC. The physical quantities such as viscosity, shear rate and velocity is plotted to analyzed the flow behavior of EMC during encapsulation. The EMC flow behavior at flip chip (FC) and free passage (FP) region in cavity are been compared. The viscosity profile of EMC is inversely proportional to the shear rate and velocity profile at FC and FP region The tendency of “frozen skin” layer occur in cavity package have been predicted with velocity profile during encapsulation.