Cu-Sn Intermetallic Compound Joints for High-Temperature Power Electronics Applications
Abstract
Cu-Sn solid-liquid interdiffusion (SLID) bonded joints were fabricated using a Sn-Cu solder paste and Cu for high-temperature power electronics applications. The interfacial reaction behaviors and the mechanical properties of Cu6Sn5 and Cu3Sn SLID-bonded joints were compared. The intermetallic compounds formed at the interfaces in the Cu-Sn SLID-bonded joints significantly affected the die shear strength of the joint. In terms of thermal and mechanical properties, the Cu3Sn SLID-bonded joint was superior to the conventional solder and the Cu6Sn5 SLID-bonded joints.
- Publication:
-
Journal of Electronic Materials
- Pub Date:
- January 2018
- DOI:
- 10.1007/s11664-017-5792-2
- Bibcode:
- 2018JEMat..47..430L
- Keywords:
-
- Power electronics;
- soldering;
- intermetallic compounds;
- lead-free solder;
- interface structure