Blistering of film from substrate after action of ultrashort laser pulse

The goal of the paper is to explain experimental results concerning film blistering. Tightly focused diffraction limited ultrashort optical laser pulse illuminates a small spot at a surface of a thin metal film mounted upon a dielectric or semiconductor support (substrate). Film mechanically separates from substrate and form a cupola like bump in a rather narrow range of absorbed fluences. Below this range deformations inside the spot are negligible. While above the range the hole remains in a film in the irradiated spot. The paper presents physical model starting from absorption and two-temperature state and including, first, description of conductive redistribution of absorbed heat, melting, hydrodynamics of strong three-dimensional deformations of a moving film, and, second, freezing of molten metal.