We present a study of Ni silicide as the bottom electrode in HfO2-based resistive random-access memory cells. Various silicidation conditions were used for each device, yielding different Ni concentrations within the electrode. A higher concentration of Ni in the bottom electrode was found to cause a parasitic SET operation during certain RESET operation cycles, being attributed to field-assisted Ni cation migration creating a Ni filament. As such, the RESET is affected unless an appropriate RESET voltage is used. Bottom electrodes with lower concentrations of Ni were able to switch at ultralow currents (RESET current <1 nA) by using a low compliance current (<500 nA). The low current is attributed to the tunneling barrier formed by the native SiO2 at the Ni silicide/HfO2 interface.