In the near future, heat transfer technology with higher performance surely has more application in the field of thermal engineering, such as electrical chip cooling, power regulating system, etc. Microbubble emission boiling (MEB) is getting more attentions by many researchers due to its extremely high heat dissipation capacity and potential application in the areas mentioned above. Despite that much work has been done to MEB, heat transfer characteristics and occurrence condition as well as formation mechanism involved MEB are not illustrated clearly by far. An experimental setup is built up to study MEB visually. The heating element is a cone copper block with its upper part of a 10mm diameter cylinder which is insulated from the water by a ceramic thimble. The different liquid subcooling is obtained by a water cooler combined with an electric heater. A high-speed video camera (Photron: Fastcam SA5) is employed for recording the scenario of MEB. Our experimental results are very similar to that from other researchers, and the maximum heat flux is about 9 MW/m2 at 60K subcooling. The presence of noncondensable gas in the vapor film and the liquid subcooling has obviously impact on MEB. Moreover, numerical simulation results show that marangoni convection is perhaps one of the reasons inducing the occurrence of MEB.
7th International Symposium on Multiphase Flow, Heat Mass Transfer and Energy Conversion
- Pub Date:
- July 2013
- Turbulent convective heat transfer;
- Cavitation and boiling;
- Boiling and bubble dynamics