Preparation and application of silver nanopaste as thermal interface materials

The power densities in electronic devices have increased dramatically; heat dissipation has become a major challenge in high performance electronics applications. We have investigated a new type of resin-free hybrid silver nanopastes, which contain silver micro-flakes with particle sizes of 1 - 10 um and silver nanoparticles with diameters of 3 - 8 nm. The assemble temperature can be as low as 150oC due to the low sintering temperature of silver nanoparticles. The fused silver micro-and nanoparticles in TIM form continuous metallic networks, resulting in good thermal, electrical and mechanical bonding. The steady-state thermal gradient measurement show the bulk thermal conductivity between 20W/ (m*K) and 100 W/ (m*K), which is higher than commercial product in the market. The application specific performance of the nanopaste has been using LED lamp on heat sinks as model test vehicle.