Through-Silicon-Via Capacitance Reduction Technique to Benefit 3-D IC Performance Katti, Guruprasad ; Stucchi, Michele ; van Olmen, Jan ; de Meyer, Kristin ; Dehaene, Wim Abstract Publication: IEEE Electron Device Letters Pub Date: June 2010 DOI: 10.1109/LED.2010.2046712 Bibcode: 2010IEDL...31..549K