Reliability analysis of Au?Sn flip-chip solder bump fabricated by co-electroplating Yoon, Jeong-Won ; Chun, Hyun-Suk ; Jung, Seung-Boo Abstract Publication: Journal of Materials Research Pub Date: May 2007 DOI: 10.1557/jmr.2007.0145 Bibcode: 2007JMatR..22.1219Y