High-speed high-accuracy fiber optic low-coherence interferometry for in situ grinding and etching process monitoring
Abstract
We present design of novel tool for characterization of wafer thickness and wafer topography employing fast low coherence fiber optic interferometer, which optical length of the reference arm of the interferometer is monitored by secondary long coherence length interferometer.
- Publication:
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Society of Photo-Optical Instrumentation Engineers (SPIE) Conference Series
- Pub Date:
- August 2006
- DOI:
- 10.1117/12.675592
- Bibcode:
- 2006SPIE.6293E..0DW