Effects of intermetallic morphology at the metallic particle/solder interface on mechanical properties of Sn-Ag-based solder joints
Abstract
- Publication:
-
Journal of Electronic Materials
- Pub Date:
- November 2003
- DOI:
- 10.1007/s11664-003-0020-7
- Bibcode:
- 2003JEMat..32.1257R