Temperature and strain rate effects on the strength and ductility of nanostructured copper
Abstract
We show that the yield strength for Cu with ultrafine grain sizes becomes obviously temperature and strain-rate dependent, in contrast to the temperature/rate insensitive behavior of conventional face-centered-cubic metals. A thermally activated deformation mechanism is operative at room temperature and especially at slow strain rates, but not at 77 K. In addition to the gain in strength, the tensile ductility and particularly uniform strains also increase at cryogenic temperatures and with increasing strain rate, as a result of improved strain hardening due to suppressed dynamic recovery.
- Publication:
-
Applied Physics Letters
- Pub Date:
- October 2003
- DOI:
- 10.1063/1.1618370
- Bibcode:
- 2003ApPhL..83.3165W
- Keywords:
-
- 81.40.Lm;
- 62.25.+g;
- 62.20.Fe;
- 81.40.Ef;
- Deformation plasticity and creep;
- Mechanical properties of nanoscale materials;
- Deformation and plasticity;
- Cold working work hardening;
- annealing post-deformation annealing quenching tempering recovery and crystallization