Computational Numerical Electromagnetics for the Solution of Guided-Wave and Radiating Problems
Abstract
Electronic packaging encompasses several different scientific and engineering disciplines. These range from applied physics, which may address the stress analysis of the materials within the package, to thermal engineering, which probes the heat transfer between individual components. In the current research we are interested in the electrical aspects since our concern is to focus attention on the design of the components and the corresponding electromagnetic field behavior within the component, and to investigate the factors which may limit the performance of very-large-scale-integrated (VLSI) circuits. Much work is being done in the area of electromagnetic modeling, particularly in the higher frequencies of operation such as those involved in the use of microwave and millimeter wave integrated circuits (MIC, MMIC, respectively) for electromagnetic systems. Although we need to observe the electromagnetic effects on the individual circuit elements themselves, we must also take into account the effects due to materials and other parameters which support and connect these elements to one another. It is of great importance that we do not neglect the interconnections, and their environments, and that we incorporate this type of information into our design procedure. Failure to do so may greatly affect the outcome of our electronic device design. The current study focuses on applications of several computational electromagnetics methodologies to electromagnetic systems. The following are examples of examples to current technology: 1. Adaptive mesh refinement is essential in the study of small discontinuities such as an iris or a thin slot. To adequately model the behavior in these regions, the discretization must be on the order of the size of the discontinuity; 2. An alternative to adaptive mesh refinement may be the use of non-standard mesh element configurations. In thin-layer regions with high field activity, standard discretization configurations such as triangle mesh elements for two-dimensional problems and tetrahedral mesh elements for three-dimensional problems may be replaced by configurations which more easily conform to the geometry of interest; and 3. Research topics may be applied in the characterization of advance material layer properties for thin-layer metallized membranes and meshes which are subsequently used for shielding. This may require first obtaining experimental results for reflection and transmission coefficients and using this information to determine permittivity and permeability of material layers.
- Publication:
-
2001 NASA-ODU American Society for Engineering Education (ASEE) Summer Faculty Fellowship Program
- Pub Date:
- December 2002
- Bibcode:
- 2002asee.nasa...76W
- Keywords:
-
- Computational Electromagnetics;
- Electronic Packaging;
- Electromagnetic Fields;
- Very Large Scale Integration;
- Millimeter Waves;
- Computational Grids;
- Microwave Circuits;
- Grid Generation (Mathematics);
- Integrated Circuits;
- Communications and Radar