Experimental investigation of Ge-doped Bi-11Ag as a new Pb-free solder alloy for power die attachment
Abstract
- Publication:
-
Journal of Electronic Materials
- Pub Date:
- November 2002
- DOI:
- 10.1007/s11664-002-0016-8
- Bibcode:
- 2002JEMat..31.1244L